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Senior Package Concept Engineer Semiconductor Products (f/m/div)*

Location
München, Bayern
Job Type
Permanent
Posted
6 Sep 2022
As Senior Staff Engineer for Package Concept Engineering you will be the first contact point for all backend related topics during the early product lifecycle. Beginning with first customer requirements you align with our technical marketing on product development strategies. With a multi-layered view on technical complex subjects and package knowhow you can implement your own ideas and solutions. The best part: You can drive innovation and see the results! With this position you will be entering the "technical ladder": our career path for experts. While setting up collaboration between frontend/backend and product development teams you will be able to get a wide spread knowledge in packaging technology. As you continually expand both your expert knowledge and network to solve problems, you will position yourself as a communication hub - establishing the connection between package innovation, package manufacturing and product definition until its realization. Responsibilities
You should be enthusiastic and dedicated to your new role because you will:
  • Examine new package concepts by considering alternatives and leverage synergies to other divisions and package development sites
  • Coordinate complex package development projects in a global and interdisciplinary environment
  • Be the go-to person for all backend relevant topics; therefore, you collaborate closely with Application Engineering, Marketing, Product Development and Package Development/Innovation at our European, American and Asian sites
  • Create and support innovative ideas in power electronic and IC packaging; therefore, you are aware of relevant trends regarding packaging
  • Create package roadmaps for individual product groups in collaboration with application engineering, marketing and backend innovation
  • Collaborate with Technical/Product Marketing to foresee future trends: prepare package technologies by triggering innovation projects and prototypes
  • Actively drive problem solving processes in the area of chip/package interplay

Your Profile
You like to collaborate with multiple stakeholders. Your specialty is the combination of working accurately and constantly bringing in new ideas. With this unique mix you produce results with real added value. If there's a flaw in a process, you are the one to find it and to add up all the strengths and knowledge from your team in order to solve the problem.

You are best equipped for this task if you have:
  • A degree Electrical Engineering, Physics, Mechanical Engineering or a related field
  • At least 5 years of relevant work experience with focus on packaging of semiconductor products
  • Good understanding of application requirements regarding packaging concepts, characteristics and related failure mechanisms
  • Excellent stakeholder management skills to handle your internal and external global interfaces with your intercultural competencies
  • Intercultural awareness and fun to work with different people and cultures; affinity to South-East Asia is a benefit
  • Experience with CAD would be a big plus
  • Fluent English and German skills in verbal and written communication

Benefits:
  • Coaching, mentoring networking possibilities
  • Wide range of training offers & planning of career development
  • International Assignments
  • Different Career Paths: Project Management, Technical Ladder, Management & Individual Contributor
  • Flexible working conditions
  • Home Office Options
  • Part-time work possible
  • Sabbatical
  • Creche and kindergarden with 180 spots and opening times until 6pm
  • Holiday Child Care
  • On-site social counselling and works doctor
  • Health promotion programs
  • On-site gym, jogging paths, beachvolleyball, tennis and soccer court
  • On-site canteen
  • Private insurance offers
  • Wage payment in case of sick leave
  • Corporate pension benefits
  • Flexible transition into retirement
  • Performance bonus
  • Cheaper ticket for public transport and very own S-Bahn station
  • Accessibility access for wheelchairs
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Details

  • Job Reference: 705315931-2
  • Date Posted: 6 September 2022
  • Recruiter: Infineon Technologies AG
  • Location: München, Bayern
  • Salary: On Application
  • Sector: Engineering
  • Job Type: Permanent